Dec 29 2010
Distinguished Prof. Kwang-Lung Lin of the Department of Materials Science and Engineering at National Cheng Kung University (NCKU), Tainan, Taiwan, the Deputy Executive Director of Industrial Technology Research Institute (ITRI) South, has received the honorary title of 2011 Institute of Electrical and Electronics Engineers (IEEE) Fellow with his outstanding achievement on the research of lead-free solder alloy and its material response, and also won the title of 2010 Materials Research Society Taiwan (MRS-T) Fellow.
Hosting the Electronic Packaging Laboratory at NCKU, Distinguished Prof. Kwang-Lung Lin, the pioneer of advanced electronic packaging technology research and environmental-friendly green electronic materials development, devoted himself to the process technology of solder bump 15 years ago, when the international industry had not massively applied the technology to consumer electronics and when the national industry had not establish such production technology.
Specialized in the research of material surface engineering, electronic packaging materials and technology and solder materials and technology, Prof. Kwang-Lung Lin received his bachelor’s degree in Chemistry from Tunghai University in 1977, master’s degree in Chemistry from The Catholic University of America, United States, in 1979 and doctoral degree of Materials Science and Engineering from Pennsylvania State University, United States, in 1984.
Prof. Kwang-Lung Lin, currently a Distinguished Professor at National Cheng Kung University and the Deputy Executive Director of Industrial Technology Research Institute (ITRI) South, has been the Director of NCKU Center for Micro/Nano Science and Technology, Director of NCKU Institute of Nanotechnology and Microsystems Engineering, Director NCKU Instrument Center, and Director of NCKU Department of Materials Science and Engineering.
Prof. Kwang-Lung Lin has received numerous awards and honors, including Distinguished Service Award of Materials Research Society Taiwan in 2007, Board of Governors in 2009, Committee Member of Surface Engineering Committee in 2009, Committee Member of Electronic Packaging and Interconnection Materials Committee in 2009, Board Committee Member of IEEE-Component, Packaging, and Manufacturing Technology Society-Taipei Chapter in 2009, and Editor-in-Chief of Materials Chemistry and Physics in 2010, in addition to IEEE Fellow and MRS-T Fellow.
The Materials Chemistry and Physics journal publishes 18 issues annually and its quality and reputation have gradually elevated year by year with 4,000 submissions by the year 2010 and a paper acceptance rate lower than 20%.
In addition, publishing over 160 papers in international journals and obtaining 16 international and national patents, Prof. Kwang-Lung Lin’s research paper has received Best Paper Award - Silver Medal of American Electroplaters and Surface Finishers Soc. (AESF) and his supervised graduate students have frequently received paper publication awards in international and national academic conferences.
The Institute of Electrical and Electronics Engineers (IEEE) is the world’s largest professional association, with 385,000 members from 160 countries, dedicated to advancing technological innovation and excellence for the benefit of humanity. IEEE and its members inspire a global community through IEEE's highly cited publications, conferences, technology standards, and professional and educational activities.
The recipients of the honorary title of 2011 Institute of Electrical and Electronics Engineers (IEEE) Fellow in Taiwan include Prof. Ching-Ray Chang of National Taiwan University, Prof. Tei-Wei Kuo of National Taiwan University, Prof. Chih-Jen Lin of National Taiwan University, Prof. Shyi-Ming Chen of National Taiwan University Science and Technology, Prof. Albert Chin of National Chiao Tung University, Prof. Li-Chun Wang of National Chiao Tung University, Prof. Jen-Inn Chyi of National Central University, Prof. Yung-Shiang Sam Han of National Taipei University, Prof. Kwang-Lung Lin of National Cheng Kung University and Prof. Chin-Long Wey of National Chip Implementation Center.