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Results 11 - 20 of 139 for Computer Accessories
  • Article - 14 Feb 2002
    Bayer have introduced Bayblend, a new line of polycarbonate/acrylonitrile butadiene styrene copolymer blends that pass the UL 94 flame retardent test. It also exhibits good formability using extrusion...
  • Article - 23 Nov 2001
    Materials with grain sizes in the order of a billionth of a meter are called nanomaterials, or nanocrystalline materials, which can be used for a range of structural and non-structural applications.
  • Article - 7 May 2001
    Elastic electret films of electromechanical film (EMFi) have the ability to sense the slightest touch, change their thickness accordingly to an external voltage and produce sound in the process....
  • Article - 15 Jul 2010
    Master Bond Inc. fast cure epoxies, polyurethane, silicones, cyanoacrylate and UV Cure systems are widely employed by manufacturers seeking maximum efficiency and greater productivity.
  • Article - 29 Mar 2006
    In this paper the concept of ‘damage-free’ machining is reviewed and the importance of machine tool characteristics highlighted with reference to diamond turning and grinding. Examples are given...
  • Article - 12 Jul 2004
    GE Global Research announced the development of the world’s best performing diode built from a carbon nanotube, which will enable smaller and faster electronic devices with increased functionality....
  • Article - 21 Oct 2002
    Tantalum is a refractory metal used mainly for making capacitors and as an alloying additive. Its main sources are described as well as a new source in Saudi Arabia. The sources of Tantalum such as...
  • Article - 26 Oct 2001
    Vinyl has been used in electrical applications for over 50 years. Factors contributing to its popularity include fire performance, economical choice, durability and versatilty. Applications range from...
  • Article - 16 Sep 2001
    The properties of polyamideimide are approaching those of Polyimide, yet it is melt processable and has the highest strength of any unreinforced thermoplastic.
  • Article - 20 Jul 2001
    Beryllium is a high melting point metal with low density. It is commonly alloyed with copper, aluminium and nickel. Other applications include aerospace, gyroscopes, radiation detectors and other...

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