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Results 2211 - 2220 of 2971 for thin films
  • News - 15 Dec 2005
    Degussa AG and Forhouse Corporation, Taichung/Taiwan, have signed agreements concerning the establishment of a joint venture for manufacturing polymethyl methacrylate (PMMA) molding compounds. The...
  • News - 30 Nov 2005
    Idemitsu Kosan Co., Ltd. and Sony Corporation have signed a Memorandum Of Understanding (MOU) on November 28, 2005 to jointly develop new superior Organic Light-Emitting Diode (OLED) luminous...
  • News - 14 Oct 2005
    Now you can extend that truism about oil and water to water and itself. Water and water don't always mix, either. The textbooks say that water readily comes together with other water, open...
  • News - 25 Jul 2005
    Scientists at The University of Manchester have discovered a new class of materials which have previously only existed in science fiction films and books. A team of British and Russian scientists...
  • News - 20 Jun 2005
    New calculations support an alternative to "superfluidity" of a solid as the explanation for the behavior of an isotope of helium, 4He, at temperatures approaching Absolute Zero, according...
  • News - 24 May 2005
    Eastman Kodak Company said that Fuji Electric Holdings Co., Ltd. of Japan (Fuji) is a licensee of Kodak’s organic light emitting diode (OLED) technology, and is applying its license toward...
  • News - 10 May 2005
    Research and Markets has announced the addition of Plastic Film - Situation and Outlook to their offering. Flexible films are defined as being planar forms of plastics, which may be thick enough to...
  • News - 27 Apr 2005
    Veeco Instruments Inc. today announced its financial results for the first quarter ended March 31, 2005. Veeco reports its results on a GAAP basis, and also provides results excluding certain charges....
  • News - 8 Apr 2005
    Cars are now able to speak by means of sensors attached to wheel rims and seats. With the new technology a car tells you if the tyre pressures are too low or the driver is falling asleep. Intelligent...
  • News - 29 Mar 2005
    A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic...

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