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Results 451 - 460 of 2555 for Electronic equipment
  • Article - 13 Feb 2004
    The Gold 80/Tin 20 eutectic alloy is used as a solder and for packaging of microelectronics, photonics and optoelectronics. The properties that make it suited to these applications are outlined.
  • Article - 20 Nov 2003
    Nitto Denko have developed a thermosetting resin with the highest refractive index of any similar material in the world. It can be increased through the addition of metal oxides. Potential...
  • Article - 29 Oct 2003
    The Palo Alto Research Center have developed the first plastic semiconductor transistor array entirely patterned using jey printing. The technology opens the door for a range of other products. Posted...
  • Article - 18 Dec 2001
    Europium (Eu) is part of the lanthanide series of elements. Demarcay discovered this element in 1901, and succeeded in isolating it in a fairly pure form from the earth.
  • Article - 28 Sep 2001
    Fillers such as carbon nanotubes and nanofibres can be used in polymer matrix nanocomposites. Matrices include polymers such as polyamides, polyesters, polycarbonates etc. Applications include...
  • Article - 18 Sep 2001
    A calcium, coppert titanate material (CaCu3Ti4O12) material is being investigated at the BNL due to unusually high dielectric constant. It is able to store extremely large amounts of charge over a...
  • Article - 29 Aug 2001
    Using a proprietary production process involving multilayers of copper, a new generation of computer chip is being produced. These overcome the poisoning effects of copper on silicon and have superior...
  • Article - 21 Aug 2001
    Relatively cheap material compared with other filled phenolics, used in automotive and electronic components.
  • Article - 20 Aug 2001
    Improved dielectric strength compared to other modified casting epoxy resins finds it useful in supply transformers and capacitor cases. Relative advantages, disadvantages and applications are listed...
  • Article - 16 Aug 2001
    Improved castability than compared with glass-reinforced grades of DAIP. Relative advantages, disadvantages and applications are listed together with a table of typical properties.

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