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Results 511 - 520 of 3585 for Electronic components
  • Grain Boundaries and Electronic Materials
    Article - 1 Aug 2001
    Grain boundaries play an important role in the electrical behaviour of some materials. Control of grain boundaries can influence how well a material performs. A method for measuring the structure of...
  • Aluminium Nitride / Aluminum Nitride (AlN) - Properties and Applications
    Article - 26 Jul 2001
    This article provides details on how aluminium nitride is produced, key properties and its applications, including microelectronics.
  • Gold - Properties and Applications of Gold
    Article - 20 Jul 2001
    Gold is most widely known as a precious metal due to its high lustre and chemical inertness. It is also used for coinage, ornaments, jewellery, gilding, textile industry, radiation control,...
  • An Introduction to Copper
    Article - 20 Jul 2001
    Copper is tough and ductile, but is valuable due its ability to conduct electricity. While it is suited to many applications most centre around its excellent electrical conductivity (e.g. busbars and...
  • Polyamide 6 - Nylon 6 - PA 6 Glass Fibre and Bead Reinforced
    Article - 12 May 2001
    Improved mechanical properties over unmodified polyamide 6 plastics. Relative advantages, disadvantages and applications are listed together with a table of typical properties for this thermoplastic.
  • Alkyd - Short Glass Fibre Reinforced
    Article - 23 Apr 2001
    Short glass fibre reinforcement leads to low mould shrinkage compared to other alkyd grades. Relative advantages and disadvantages listed together with a summary property table.
  • Alkyd
    Article - 23 Apr 2001
    A brief overview of the relative advantages and disadvantages of the Alkyd family of thermosetting polymers.
  • Diallyl Phthalate - DAP Short Glass Fibre Reinforced Reinforced
    Article - 30 Mar 2001
    Good tensile strength, flexural modulus and elongation at break with the best combination of volume resistance and dielectric strength when compared with other modified grades of DAP.
  • Embedding of Active Components in Laser Sintering of Circuit Boards
    News - 20 May 2022
    In an article recently published in the journal Additive Manufacturing Letters, researchers discussed electronic component embedding during selective laser sintering (SLS) methodology. Study:...
  • Foamed Engineering Polymers from Zotefoams
    Article - 16 Apr 2003
    Zotefoams have developed a range of foamed engineering polymers using a unique manufacturing technology. Materials, properties and applications are briefly outlined. Posted January 2003

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