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Results 701 - 710 of 3585 for Electronic components
  • Article - 18 Sep 2001
    Very good flame retardant characteristics (VO>2) compared with unmodified SAN (HB). Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 10 Sep 2001
    Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 29 Aug 2001
    Using a proprietary production process involving multilayers of copper, a new generation of computer chip is being produced. These overcome the poisoning effects of copper on silicon and have superior...
  • Article - 21 Aug 2001
    Relatively cheap material compared with other filled phenolics, used in automotive and electronic components.
  • Article - 21 Aug 2001
    Exhibits improved mechanical and serviceable properties. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 21 Aug 2001
    Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 20 Aug 2001
    Improved dielectric strength compared to other modified casting epoxy resins finds it useful in supply transformers and capacitor cases. Relative advantages, disadvantages and applications are listed...
  • Article - 16 Aug 2001
    Improved castability than compared with glass-reinforced grades of DAIP. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 16 Aug 2001
    Best combination of electrical characteristics compared with other filled phenolics. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 29 Jul 2001
    Molybdenum is silvery-white, very hard refractory metal, however, it is softer and more ductile than tungsten and is readily worked or drawn into very fine wire. Primary uses are as an alloying...

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