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XMC Receives ISO/TS16949 Qualification for Supplying Components to Global Automotive Industry

XMC Receives ISO/TS16949 Qualification for Supplying Components to Global Automotive Industry

New IKONIC 4000 Series of Chemical Mechanical Planarization Polishing Pads from Dow Electronic Materials

New IKONIC 4000 Series of Chemical Mechanical Planarization Polishing Pads from Dow Electronic Materials

Outokumpu Plans to Discontinue Operations in Kloster, Sweden

Outokumpu Plans to Discontinue Operations in Kloster, Sweden

BASF Introduces New VOCat 200 Series Base Metal Catalyst

BASF Introduces New VOCat 200 Series Base Metal Catalyst

Leica Microsystems Launches the DCM8 3D Surface Metrology Instrument

Leica Microsystems Launches the DCM8 3D Surface Metrology Instrument

Porvair Sciences to Highlight Latest Specialist Microplates and Microplate Equipment at Major Exhibitions

Porvair Sciences to Highlight Latest Specialist Microplates and Microplate Equipment at Major Exhibitions

New Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications from Engineered Material Systems

New Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications from Engineered Material Systems

Powder Metallurgy Thesis Competition 2014 Launched by EPMA

Powder Metallurgy Thesis Competition 2014 Launched by EPMA

This Year Pittcon Welcomes 114 New Exhibiting Companies - Pittcon 2014

Linde Signs Engineering and Procurement Contract for Two Hydrogen Plants in Russia

Linde Signs Engineering and Procurement Contract for Two Hydrogen Plants in Russia

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