Materials Processing News

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Dawn of Pervasive Computing

WRAP to Provide Incentives for Tyre Reprocessing

DuPont Packaging and Industrial Polymers Open R+D Facility in China

Laser Light to Break Selected Chemical Bonds Seen as a Key Step in Computer Chip and Solar Cell Manufacture

DuPont Announces New Display Technologies

Scientists Uses Laser Light to Strip Hydrogen Atoms from Silicon Surfaces

Raymor Receives Order from Boeing for Spherical Metallic Powder-Nitinol

SABIC Embarks on Major Expansion Program in Asia Pacific

Wacker to Build New Production Facility to Increase Dispersible Polymer Capacity

Siemens Invests EUR90 Million in Emerging Oil and Gas Market

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