Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced availability of the new DesignWare® ARC® EM SEP (Safety Enhancement Package) Processor core for automotive safety-compliant applications.
Heilind Electronics, the largest distributor of interconnect products in North America, is now stocking TE Connectivity's (TE) UV-Resistant Sealed Circular Plastic Connectors (CPC).
Reportlinker.com announces that a new market research report is available in its catalogue: Aluminum Electrolytic Capacitors: World Markets, Technologies & Opportunities: 2013-2018
RS Components (RS) and Allied Electronics (Allied), the trading brands of Electrocomponents plc (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, are spurring the world’s engineers into creative combat with an invitation to pit their design skills against each other using DesignSpark Mechanical, the companies’ new free and intuitive 3D design software, co-developed with SpaceClaim.
Texas Instruments Incorporated (TI) today announced the company has been named a Thomson Reuters 2013 Top 100 Global Innovator. The program, an initiative of the IP Solutions business of Thomson Reuters, honors corporations and institutions around the world that are consistently driving innovation. This is the second consecutive year TI has been recognized with this distinction.
Vishay Intertechnology, Inc. today announced that it is hosting a full-day seminar program on Oct. 16 in conjunction with the China Power Supply Society. The program will take place at the Changjiang Hotel Wuhan, in Wuhan, China, and will feature talks on power MOSFETs, power modules, optoelectronics, and diodes. There will also be a number of industry experts making presentations on a wide range of topics.
Nordson MARCH, a Nordson Company, a global leader in plasma processing technology, will present the paper “Overcoming the Challenges Presented with Automated Selective Conformal Coating of Advanced Electronic Assemblies by Employing Plasma Treatment Technology,” by David Foote, global applications manager, Nordson MARCH, at SMTA International 2013, Fort Worth, TX, Tuesday, October 15, from 4:00–5:30 PM, in Technical Session MFX3, Room 202D.
Power management company Eaton is delighted to announce that its manufacturing plant in Worksop, United Kingdom, has won the Energy & Environment category at this year’s Best Factory Awards. The awards were presented at a ceremony held in London on 27th September, and additionally saw Eaton being Highly Commended for its plant in the highly regarded Best Electronics & Electrical Plant category.
Indium Corporation introduces a new,high-reliability, low-voiding flux coating for solder preforms. LV1000 reduces false failures while increasing productivity, throughput yields, and component performance. This new halide-free (ROL0)materialis especially suited for assembly processesin which the components don’t allow for proper outgassing of volatized flux.
Dow Electronic Materials, a business unit of The Dow Chemical Company, today announced availability of its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
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