Packaging News

RSS
New UBM PVD System Redefines Productivity and Reliability for Chip Packaging

New UBM PVD System Redefines Productivity and Reliability for Chip Packaging

LyondellBasell to Present 10 Papers on Polyolefins Products and Technologies at NPE2009

New Polypropylene Resin for Blown Film Applications from LyondellBasell

New Polypropylene Resin for Blown Film Applications from LyondellBasell

Two New Polyethylene Resins Launched for the Food Packaging Market

Dow Corning Establishes New Silicone Production Unit Exclusively for LEDs

Dow Corning Establishes New Silicone Production Unit Exclusively for LEDs

New Report on Nanotechnology in Consumer Goods

Flexible Packaging Market Worth Over $1.4 Billion

New Water-Based Laminating and Glued Lap Adhesive for Packaging

Unique Purging Compound for The Thermoplastics Insdustry

New Family of Sealable Polyester Prodcts Designed to Replace PVC Packaging

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.