There's a good way to remember the name of Graham Packaging's new sustainability leader in a 20-ounce PET stock hot-fill bottle. Just say, "Gee, it's light." Indeed, it is light-and it's called ...
Rudolph Technologies, Inc. (NASDAQ: RTEC) and SEMATECH, the global consortium of leading chipmakers, announced today that Rudolph has joined SEMATECH's 3D Interconnect Program at the College of Nanoscale Science and ...
Researchers at the University of Minnesota School of Public Health found most containers employed for storage and transportation of used fluorescent lamps to recycling centers do not provide necessary levels of protectio...
ZettaCore, Inc., a developer of molecular electronics, today announced Molecular Interface(TM) (MI) technology. This nano treatment technology makes possible dramatic improvement in interconnect density without requiring...
In a structure as theatrical as the shows for which it sells tickets, the TKTS Booth, long a fixture in the heart of New York City’s Times Square, has been made over into a glass structure that would not have been possible without the strength and protection of DuPont SentryGlas interlayers.
Increasing environmental issues are pushing the activity in the plastic bottle recycling industry to greater heights. Ability of the recycling business to add value to the materials has enabled the plastic bottle recycling market to cross 12.4 million tons by 2012.
Borouge 3 to come on stream in Q4 2013 to capture the additional feedstock
availability resulting from the upstream refinery and gas processing expansions
of ADNOC (Abu Dhabi National Oil Company) Approximately 2.5 million tonnes per
year (t/y) of polyolefins capacity to be added to support Borouge's growth in
the Middle East and Asia.
Once the stuff of pure research, bioplastics have become a fast-growing business
for marketers and technologists in the plastics industry mainstream. NPE2009,
the central event in the industry's calendar, will stand as a milestone
in this historical transition, according to The Society of the Plastics Industry,
Inc. (SPI), producer of the triennial NPE.
CEA/Leti (the Electronics and Information Technology Laboratory of the CEA, based in Grenoble), and IBM announced that they will collaborate on research in semiconductor and nanoelectronics technology.
This five-year...
Extrusion Dies Industries, LLC (EDI) and ITW
Dynatec have reached a worldwide agreement to market turnkey hot melt adhesive
coating stations combining ITW Dynatec's melting and fluid delivery equipment
with EDI's slot die systems, the companies announced today.
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