Pregis Corporation, a leading international manufacturer, marketer, and supplier of protective packaging products and specialty packaging solutions, announced today that it has acquired all of the outstanding share capit...
Borealis and Borouge, leading providers of innovative, value creating plastic solutions, will showcase exciting new developments at K 2007. Customers from the entire value chain are invited to their high profile stand, C...
Rio Tinto and Alcan today announced they have reached an agreement for Rio Tinto to make an offer to acquire all of Alcan's outstanding common shares for US$101 per common share in a recommended, all cash transaction...
Research and Markets has announced the addition of Additive Migration from Plastics into Foods - A Guide for the Analytical Chemist to their offering.
Plastics are now being used on a large scale for the packaging of...
Alcan Inc. today announced that its subsidiary Alcan Airex in Sins, Switzerland has acquired the patents and know-how for foamable PET (polyethylene terephthalate) technology from Italy-based Mossi & Ghisolfi Group, ...
Albemarle Corporation has completed definitive agreements with its Chinese partner to increase Albemarle's ownership from 25% to 75% in two joint ventures: Ningbo Jinhai Albemarle Chemical & Industry Co., Ltd. an...
Rexam, the global consumer packaging company and the world's leading beverage can maker, is pleased to announce that it has agreed to acquire Rostar, the Russian beverage can maker, from En+ Group Limited, the parent...
Huntsman Corporation today announced that its Textiles Effects business has signed an agreement to acquire the Baroda division of Metrochem Industries Ltd for $46.5 million in cash. The division to be acquired by Huntsma...
BASF wants to further expand its strong position in the worldwide plastics business by firmly focusing its activities on customer and market requirements. This statement was made today (July 3, 2007) by Dr. John Feldmann...
Dow Corning Corp. today introduced two new members of its family of lid-seal materials for flip-chip semiconductor packages. One offers a two-fold improvement in cure rate, and another is specifically formulated for the ...
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