Hitachi Chemical Company will increase the production capacity of die bonding films by 50 percent in phases by September 2006. Demand for the films, which are used in producing stacked multi-chip packages (stacked MCPs) ...
A recent EU project designed and developed a new demonstrator microchip that will dramatically cut the cost of producing new wireless products and could mean that a whole range of existing products will be enabled for wi...
Konarka Technologies, Inc., an innovator in developing and commercializing power plastics that convert light to energy, today announced Walter Rosenberg, founder of Osprey Consulting, Inc. and a longtime environmental re...
A research team led by engineers at the University of California, Berkeley, has developed a new technique to handle metal defects in low-grade silicon, an advance that could dramatically reduce the cost of solar cells.
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IBM has announced the availability of its fourth generation silicon germanium foundry technology, named 8HP -- with over 2X performance of the previous generation. The new 130 nanometer (nm) silicon germanium (SiGe) bipo...
A Northrop Grumman Corporation -led team will develop lightweight, compact, high-power electronic modules that may make the bulky, heavy transformers used to distribute electrical power on ships a thing of the past. The ...
Atmel Corporation, a global leader in the development and fabrication of advanced semiconductor solutions, and 1st Silicon, a premier semiconductor-manufacturing foundry, announced today the start of Atmel Flash memory p...
One of the biggest obstacles facing computer systems today is the problem of memory latency, the time a computer must wait to access the data stored in memory despite faster processor speeds. Two demonstrators reveal tha...
A new sensor being patented by Ohio State University could be used to detect concealed weapons or help pilots see better through rain and fog.
Unlike X-ray machines or radar instruments, the sensor doesn't have to...
For about 40 years, the semiconductor industry has been able to continually shrink the electronic components on silicon chips, packing ever more performance into computers. Now, fundamental physical limits to current tec...
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