SACHEM is announcing the release of Reveal Etch™, a wet chemistry designed to enable a single-step silicon etch / TSV reveal process. SACHEM and Solid State Equipment, LLC (SSEC) developed the process for this chemistry and optimized its use in a single-wafer processor.
Researchers around the world are trying to develop solar-driven generators that can split water, yielding hydrogen gas that could be used as clean fuel. Such a device requires efficient light-absorbing materials that attract and hold sunlight to drive the chemical reactions involved in water splitting.
Aehr Test Systems, a worldwide supplier of semiconductor test and burn-in equipment, today announced it has shipped ABTS Burn-in and Test Systems to two new customers in China, one to a Chinese semiconductor foundry to fill a previously announced order and the other to a Chinese government research institute.
SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that a leading Chinese wafer level packaging (WLP) supplier to the electronics industry has selected the Omega fxP Etch System for cost-effective through silicon via (TSV) processing of 300mm wafers for CMOS Image Sensor (CIS) applications.
Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will share his expertise at the International Union of Materials Research Societies – International Conference on Electronic Materials (IUMRS-ICEM) from June 10-14 at Taipei World Trade Center Nangang Exhibition Hall in Taipei, Taiwan.
Leading semiconductor test equipment supplier Advantest Corporation has released its new EVA100 measurement system, an evolutionary value-added platform that combines digital and analog testing capabilities to handle small-pin-count analog, mixed-signal and sensor semiconductors.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Shanghai Simgui Technology Co., Ltd. (Simgui), a Chinese silicon-based semiconductor materials company, have formed an international partnership to address both China's growing demand and limited worldwide production capacity for 200-mm silicon-on-insulator (SOI) wafers used in fabricating semiconductors for radio-frequency (RF) and power applications.
Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, recently signed a global distribution agreement with Akros Silicon, a provider of leading-edge power management ICs. Akros’ solutions help manufacturers of electronic equipment create more efficient and advanced products at reduced costs, while enabling end users the ability to reduce energy usage.
Vishay Intertechnology, Inc. today announced its technology lineup for the 2014 IEEE MTT International Microwave Symposium (IMS2014), being held from June 1-6 at the Tampa Convention Center in Tampa Bay, Florida. At the conference and exhibition, the company will be highlighting its latest industry-leading multilayer ceramic chip capacitors (MLCCs) and surface-mount and wire-bondable thin film products.
Indium Corporation’s Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.
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