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Fairchild Semiconductor Introduces Series of 1200 V Field Stop Trench IGBTs

Fairchild Semiconductor Introduces Series of 1200 V Field Stop Trench IGBTs

Soitec Reaches High-Volume Manufacturing of New Enhanced Signal Integrity Substrates

Soitec Reaches High-Volume Manufacturing of New Enhanced Signal Integrity Substrates

TowerJazz to Provide Technical and Manufacturing Capabilities to Shanghai ICC’s Customers

TowerJazz to Provide Technical and Manufacturing Capabilities to Shanghai ICC’s Customers

LTX-Credence Acquires Dover’s Multitest and Everett Charles Technologies Businesses

LTX-Credence Acquires Dover’s Multitest and Everett Charles Technologies Businesses

Advantest Installs T2000 Integrated Power Device Test Solution at Toyota Motor for Evaluating Integrated Power ICs

Advantest Installs T2000 Integrated Power Device Test Solution at Toyota Motor for Evaluating Integrated Power ICs

NXP Enters JV with Datang Telecom to Establish Chinese Automotive Semiconductor Company

NXP Enters JV with Datang Telecom to Establish Chinese Automotive Semiconductor Company

CDP Lists UMC on Climate Performance and Climate Disclosure Leadership Indexes

CDP Lists UMC on Climate Performance and Climate Disclosure Leadership Indexes

Soitec and SunEdison Sign Patent Cross-License Agreement for SOI Wafer Products

Soitec and SunEdison Sign Patent Cross-License Agreement for SOI Wafer Products

Advantest Unveils Field-Upgradable Test Handler for System-on-Chip Devices

Advantest Unveils Field-Upgradable Test Handler for System-on-Chip Devices

Rudolph Receives Orders for AWX FSI Unpatterned Wafer Inspection System

Rudolph Receives Orders for AWX FSI Unpatterned Wafer Inspection System

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