Imec today announced a cryogenic etching method that protectsthe surface of porous ultralow-k dielectrics against excessive plasma induced damages.
Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today announced it has moved its corporate headquarters to 9740 Irvine Blvd., in Irvine, California.
Leading semiconductor test equipment supplier Advantest Corporation's new T5831 system for testing next-generation ICs used in mobile applications, including NAND Flash with high-speed ONFi or Toggle Mode interfaces as well as managed NAND devices such as embedded multi-media cards (eMMC), is now being delivered to customers.
Leading semiconductor test equipment supplier Advantest Corporation has entered the market for testing system-on-chip (SoC) mobile power-management ICs (PMIC) by delivering the semiconductor industry's most cost-compelling solution using the V93000 platform.
Vishay Intertechnology, Inc. today announced that it will be exhibiting its latest semiconductors and passive components in booth 1D-207 at Power System Japan, a focused exhibition on power systems at Techno-Frontier 2013, being held at the Tokyo Big Sight from July 17 to 19, 2013.
Fujitsu Semiconductor Limited and ARM today announced a licensing agreement that enables Fujitsu Semiconductor to release a system on chip (SoC) solution which takes advantage of the benefits of ARM big.LITTLE™ technology and ARM Mali-T624 graphics processing.
Toshiba Corporation today announced that it will expand its state-of-art No. 5 semiconductor fabrication facility (Fab 5) at Yokkaichi Operations in Mie, Japan, to secure manufacturing space for NAND flash memories fabricated with next generation process technology and for future 3D memories.
OPEL Technologies Inc. (“OPEL” or “the Company”) announces that it has achieved Milestone 6 in its development roadmap of the proprietary planar optoelectronic technology (POET) platform for monolithic fabrication of integrated electronic and optical devices on a single semiconductor wafer, a next-generation alternative to silicon complementary metal-oxide semiconductor (CMOS) technology..
ON Semiconductor Corporation today announced it has been awarded a 2012 Total Cost of Ownership (TCOOTM) Supplier Award from Celestica, a global leader in the delivery of end-to-end product lifecycle solutions. Celestica’s awards program recognizes suppliers that support Celestica’s TCOO strategy and demonstrate excellence in quality, delivery, technology, service, pricing and flexibility.
Schrödinger Inc., a technology leader in atomic-scale modeling and physics-based chemical simulations, and Dr. Mark E. Thompson, Professor of Chemistry at the University of Southern California, announced today their joint research collaboration to advance the development and design of organic semiconductor materials through use of atomic-scale simulations.
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