Leading semiconductor test equipment supplier Advantest Corporation today introduced its new T2000 8GWGD instrument, incorporating an 8-giga-samples-per-second (Gsps) waveform generator and an 8 GHz digitizer into a module for testing system-on-chip (SoC) devices used in mass-storage devices, including hard disk drives (HDDs).
Wide bandgap semiconductors – specifically, silicon carbide (SiC) and gallium nitride (GaN) – will lead the charge as the market for solar inverter discrete devices, driven by the downstream demand for solar modules, grows to $1.4 billion in 2020, according to Lux Research. That reflects a solid 7% CAGR, slightly lower than the 9% for all renewables and grid-based power electronics.
Research and Markets has announced the addition of the "Global 3D Semiconductor Packaging Market 2012-2016" report to their offering.
Teledyne DALSA is proud to have received a 2013 Bell Award of Excellence from the Armand Frappier Foundation, one of four awards presented at the Foundation’s Garden Party benefit gala on June 13.
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today announced the monolithic integration of a transistor, Zener diode and resistor into a standard SOT89 package.
United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the opening of its UMC Korea office to help expand regional business and provide local support to customers.
Vishay Intertechnology, Inc. today announced that the company has received 2012 Supplier Excellence Awards in North America and Europe from TTI, Inc. Vishay is one of the world’s largest manufacturers of discrete semiconductors and passive electronic components. TTI is the world’s leading authorized distributor specialist offering passive, connector, electromechanical, and discrete components.
eMemory, an embedded non-volatile memory (eNVM) industry leader and United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced an expanded technology cooperation to integrate eMemory's one-time-programmable (OTP) and multiple-time-programmable (MTP) embedded non-volatile memory technologies into UMC's 28nm process.
Could radio frequency signals become the next major energy source for industrial, scientific and medical (ISM) applications? At the IEEE International Microwave Symposium this week, NXP Semiconductors N.V. is introducing the industry’s first complete RF power transistor portfolio designed specifically for the 2.45-GHz ISM frequency band, enabling RF energy to be used as a clean, highly efficient and controllable heat source.
IBM today introduced the fifth generation of semiconductor technology specialized for high performance communications. The company’s latest silicon-germanium (SiGe) chip-making process is designed to enable ever-increasing amounts of data to flow through network backbones in applications such as Wi-Fi, LTE cellular, wireless backhaul and high speed optical communications.
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