AXT, Inc., a leading manufacturer of compound semiconductor substrates, today announced that it has been certified as having met the international standards of ISO 16949:2009, a worldwide standard developed by the International Automotive Task Force (IATF), a group of the world's leading manufacturers and trade organizations.
Axcelis Technologies, Inc., a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today the Company's innovative Purion MTM medium current implanter has been selected by another one of the world's leading chipmakers. The system will be used to develop and manufacture next generation memory and FLASH devices.
Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited ("BCD") in an all cash deal, valued at approximately $151 million.
Keithley Instruments, Inc., a world leader in advanced electrical test instruments and systems, announced today that the editors of Electronic Products magazine have honored the company’s new Parametric Curve Tracer (PCT) Configurations as a “Product of the Year” award winner for 2012 in the test and measurement category.
MagnaChip Semiconductor Corporation ("MagnaChip"), a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products, today announced that it now offers a 0.35-micron ultra-high voltage 700V BCD (Bipolar/CMOS/DMOS) process technology targeted at the growing smart energy market for applications such as AC-DC and switched-mode power supplies as well as LED lighting.
After experiencing a slowdown in 2012 the global semiconductor market is set for growth. The World Semiconductor Trade Statistics predicts the global semiconductor market to grow by 4.5 percent in 2013 after declining 3.2 percent in 2012.
Microsemi Corporation, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that it has been elected to lead the Electronic Component Sintered Interconnections (ELCOSINT) industry team in developing novel polymeric, sintered interconnection materials to replace high lead (Pb) content materials and further increase the operating temperature of electronic assemblies.
Micron Technology, Inc. and LFoundry today announced that the companies have entered into agreements for LFoundry to acquire Micron Technology Italia, Srl. and all of its semiconductor fabrication facility assets in Avezzano, Italy.
GeneSiC Semiconductor, a pioneer and global supplier of a broad range of Silicon Carbide (SiC) power semiconductors today announces the immediate availability of a family of 1700V and 1200 V SiC Junction Transistors.
Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, and Sumitomo Electric Industries, Ltd., a leading worldwide provider of compound semiconductor materials, have signed a licensing and technology-transfer agreement under which Sumitomo Electric will use Soitec's proprietary Smart Cut™ technology to manufacture engineered gallium nitride (GaN) substrates.
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