C. Grant Willson, professor of chemistry and chemical engineering at The University of Texas at Austin, has won the Japan Prize, an international award similar to the Nobel Prize, for his development of a process that is now used to manufacture nearly all of the microprocessors and memory chips in the world.
3M announced today at DesignCon 2013 the full launch of its Embedded Capacitance Material (ECM) C2006. The ultra-thin laminate material is now available for high-volume manufacturing. With a capacitance density of approximately 20 nF per square inch, the material offers one of the highest capacitance densities currently available on the market in a halogen-free* product.
Voltaix, Inc. a leading manufacturer of specialty materials for the semiconductor and photovoltaic industries, and Linde Electronics, the global electronics business of The Linde Group, announced the signing of an agreement to expand disilane (Si2H6) capacity with the construction of a 40 metric ton Ultra High Purity (UHP) disilane plant.
Nordson ASYMTEK, a leader in dispensing, coating, and jetting technologies, will demonstrate precision dispensing solutions for LED and semiconductor packaging at LED Korea 2013, booth #4228, Hall B. Applications include phosphor coating for tight CIE LEDs, high-throughput silicone phosphor encapsulation, pure silicone casting, flux, and underfill for flip chip, package-on-package (PoP), chip scale packages (CSP), and ball grid arrays (BGA).
NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that Canada’s South Coast British Columbia Transportation Authority (TransLink) has adopted its MIFARE technology platform for Vancouver’s public transpo...
Alpha and Omega Semiconductor Limited (AOS), a designer, developer and global supplier of a broad range of power semiconductors and power ICs, today introduced the first of a new product line of Power Factor Correction (PFC) devices; the AOZ7111 is an active power factor correction controller which integrates a number of safety features and functions for the design of robust, efficient and cost-effective off-line power conversion solutions.
At the heart of computing are tiny crystals that transmit and store digital information's ones and zeroes. Today these are hard and brittle materials. But cheap, flexible, nontoxic organic molecules may play a role in the future of hardware.
KEMET Corporation, a leading manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, today introduced its new T496 Hi-Rel Fused Commercial-Off-the-Shelf (COTS) MnO2 Series of tantalum surface mount capacitors.
Synopsys, Inc., a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced immediate availability of its comprehensive solution for FinFET-based semiconductor designs.
At the European 3D TSV Summit in Grenoble, France on January 22-23, 2013, imec, a world-leading nano-electronics research institute, today announced that together with Cadence Design Systems they have developed, implemented and validated an automated 3D Design-for-Test (DFT) solution to test logic-memory interconnects in DRAM-on-logic stacks. The solution, based on Cadence® Encounter® Test technology, was verified on an industrial test chip containing a logic die and a JEDEC-compliant Wide-I/O Mobile DRAM.
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