Nov 21 2007
SABIC Innovative Plastics today announced the expansion of its LNP* Faradex* family of specialty compounds to help electronics manufacturers achieve lighter-weight, thinner-wall housings with enhanced shielding capability. SABIC Innovative Plastics’ new LNP Faradex compounds can deliver better electromagnetic interference/radio frequency interference (EMI/RFI) shielding performance without increasing their loading of stainless steel fibers, thereby keeping costs and part weight down. Proprietary filler technology not only improves inherent shielding capability of existing loadings, but also increases modulus to enable strong and durable thin-wall parts. The addition of the new LNP Faradex compounds provides customers with an even broader range of EMI/RFI shielding performances and physical properties to help meet customer requirements.
The five new LNP Faradex compounds are alloys of polycarbonate and acrylonitrile butadiene styrene (PC/ABS). They include three grades featuring non-brominated, non-chlorinated flame retardants (FR) for compliance with such environmental regulations as the EU’s WEEE and RoHS directives, and other eco labels. The two non-FR grades offer higher impact resistance than previous LNP Faradex compounds. Varieties of other base resins are also available based on customer requirements.
“To help our customers design streamlined, easy-to-handle electronic devices that can squeeze more functionality into the same space, we have created proprietary technology that actually increases shielding performance without any additional stainless steel fiber, and raises modulus by more than a third,” said Eric Jiang, LNP product manager, SABIC Innovative Plastics. “New LNP Faradex compounds offer manufacturers competitive advantages. These Faradex compounds offer EMI/RFI shielding performance without costly secondary operations as compared to typical molded polymeric products, so total cycle time and total system cost reductions are possible. As compared to the traditional metals used for EMI/RFI shielding, new LNP Faradex compounds provide not only design flexibility but also weight reduction while maintaining the required EMI/RFI shielding performance. We expect these products to be widely adopted in automotive applications as well as in housings for electronic devices and telecom applications.”
Applications for the flame-retardant grades of the new Faradex compounds include enclosures for virtually any small or medium-size electronic devices, such as servers, portable meters, and projectors. The non-FR grades are excellent candidates for digital camera housings and audio systems in vehicles.
The new LNP Faradex compounds provide mechanical properties, part weight, and design freedom similar to those of standard unfilled base resins. Because their inherent shielding technology eliminates costly secondary steps such as applying a metallized layer to plastic components, manufacturers can potentially reduce total system costs. EMI/RFI attenuation permeates the part, ensuring consistent performance even in the case of surface scratches. Further, the ability to injection-mold new Faradex compounds enables intricate part design.
New LNP Faradex specialty compounds will be available in China in December 2007.