Nov 22 2007
A new grade of DuPont™ Zenite® LCP liquid crystal polymer meets needs for ultra-low warpage in the thinner part designs used in ever smaller electronic devices. Typical applications for new Zenite® ZE55201 include electronic connectors, chip sockets and interposers.
Zenite® is used in several generations of central processing unit sockets for personal computers.
"Standard resins that perform perfectly well in thicker parts can produce unacceptable warpage in the emerging generation of low-profile designs," said Bill Hassink, senior market development specialist for DuPont Engineering Polymers. "New Zenite® ZE55201 has shown that it can meet the challenge in molding trials and early production experience."
The new resin's ultra-low-warp performance is achieved by reducing anisotropic shrinkage. Its flow direction shrinkage is similar to that of a typical 30 percent glass-reinforced LCP, but its cross-flow shrinkage is more than 50 percent lower.