Mar 19 2008
High material throughput with lowest manufacturing costs in electronic component production
Roll to roll laser process
Die 3D-Micromac AG, leading supplier of customized laser micro machining systems now offers the development and production of roll-to-roll laser processing for ablation of thin film on flexible substrates.
Extreme flat and flexible electronic devices are capturing many fields of our daily life. Due to this fact there are systems required which can reach a high throughput with lowest manufacturing costs, especially for new product developments. Roll-to-roll manufacturing methods can reduce the expenses severely.
A special feature of the 3D-Micromac roll-to-roll technology is the laser processing of substrates on the fly. That means a continuous winding process for reaching of a very high throughput.
The winding speed is around 17 to 170 meters per minute. Different flexible substrates (paper or foil) can be processed with the system. The integration of different laser sources ¨C based on customers requirements ¨C is possible.
Even films with different characteristics for instance solar cells, sensors, actuators, and electronics - on polymer base ¨C can be processed.
Posted March 19th,2008