Chinese Chip Manufacturer Orders NEXX’s Tool for Wafer-Level Packaging

NEXX Systems– a leading provider of advanced wafer-level chip scale packaging equipment, headquartered in the Boston area – today announced a repeat sputter tool order for an Apollo physical vapor deposition system to an emerging leader in flip chip manufacturing at their wafer bumping facility in China.

The Apollo physical vapor deposition system will be used for wafer-level packaging of licensed CMOS image sensor technology. The Chinese outsourced assembly and test fab selected the Apollo based on its capabilities for superior temperature control, high throughput and exceptional via coverage. Through this sale, NEXX has expanded our installed base in image sensor technology to include some of the key players in CMOS image sensor technology and production.