Nov 16 2010
Oxford Advanced Surfaces Group Plc (OAS), the advanced materials company, announced today that they have successfully completed the Technology Strategy Board -funded project work on Customised Adhesion of Inter-layers for Plastic Electronics (CAIPE).
The project aimed to develop a much needed solution to the persistent interlayer delamination problems facing device manufacturers in Plastic Electronics. In collaboration with their project partners PETEC (Printable Electronics Technology Centre) and OMIC (Organic Materials Innovation Centre) the technology has delivered robust adhesion between the different interfaces in the multilayer flexible electronic device. Impressively, this has been achieved using a solution printing process. A second phase of work will now commence with our partner to reach pilot scale and to market the technology to the global electronics sector.”
“The printed electronics market is forecasted to be in the order of $10B by 2015 in multiple application areas from displays to photovoltaics ” commented Mike Edwards, VP of Sales & Marketing. “The collaboration with PETEC has served as a concrete validation of our Onto™ interlayer adhesion technology and we look forward to continuing this relationship as we seek global licensing partners in the area of printed electronics”.
Myrddin Jones, Lead Technologist at the Technology Strategy Board, said: "This investment shows how the Technology Strategy Board supports and accelerates technology innovation, helping to give UK companies a competitive edge and a springboard into the global marketplace. We are delighted with the success of the CAIPE project and look forward to the technology being marketed worldwide."