Jan 27 2011
Cabot Microelectronics Corporation (Nasdaq:CCMP), the world's leading supplier of chemical mechanical planarization (CMP) polishing slurries and a growing CMP pad supplier to the semiconductor industry, today announced the launch of its Novus(TM) A7000 series Aluminum CMP slurry intended to enable its customers' advanced High-K and Metal Gate device integration schemes.
The Novus A7000 series Aluminum CMP slurry builds on Cabot Microelectronics’ industry-leading CMP technology and is the result of extensive research and development. The Novus A7000 series contains alumina particles that provide the ability to remove aluminum and the complex stack of metals within the transistor gates of advanced semiconductor devices. This slurry is formulated with unique chemistries that optimize removal rate, while meeting low defectivity requirements. Additionally, the Novus A7000 series was designed to stop polishing on oxide and limit aluminum dishing, both of which minimize gate height, improving transistor performance and device reliability.
Donald Wiseman, Cabot Microelectronics' Global Business Director for Metals Slurry, stated, "The Novus A7000 series Aluminum CMP slurry provides advanced node customers with a solution for a critical process step in enabling High-K and Metal Gate device integration. We believe this new slurry is applicable across a wide range of feature sizes and densities and offers customers unmatched quality, performance and optimal cost of ownership."