Avantor Performance Materials, a manufacturer and distributor of high-performance chemistries and materials, has signed a joint development agreement with SACHEM, a global chemical sciences firm serving customers in major markets including agricultural chemicals, pharmaceutical, catalysts, polymers, starch modification, biotechnology and electronics, to develop new selective etch materials for the semiconductor industry.
Both companies will team up to produce specialty surface preparations and removal solutions for thin-film wafer stacks. The deal integrates Avantor’s expertise in photoresist solutions and residue removal technologies with SACHEM’s proficiency in etchants and surface preparations chemistries. This will help develop advanced, customized selective etch solutions that could minimize process steps and production costs and also enhance device yield.
Under the terms of the agreement, the first etch solution to be implemented is the J.T.Baker SLCT sigma etchant, which will be used for FEOL poly gate structuring. The product will be released at SEMICON West 2011 trade show.
Both companies have formed a worldwide applications team that is supported by enhanced wafer processing equipment of Avantor. The companies will work together to bring customized selective etch chemistries such as SLCT 128 into the market.
In addition, Avantor and SACHEM have partnered with Asia’s and America’s largest semiconductor manufacturers to develop other selective etch and layer removal solutions.