Rehm Selects Viscom’s X8011 X-Ray Inspection System for Void-Free Soldering Process

Rehm Thermal Systems, a provider of drying and soldering systems, has announced that the company has chosen Viscom’s X8011 X-ray system.

Rehm has been already using a variety of X-ray systems. Therefore, the company may invest in its own system to examine the soldered connections. Its new applications center installed Viscom’s X8011 PCB flex X-ray system for use in process verification. The aim of the company was to efficiently study the void-free and lead-free soldered connections specifically under vacuum conditions, to modify the products based on the future demands of customers.

Rehm’s head of applications and soldering technology product management, Helmut Öttl has experience in testing and operating X-ray systems for over 10 years. According to Helmut, the company is using X-ray inspection systems bought from various suppliers. Those inspection systems may reliably during production. The X8011 has good contrast and high detail accuracy. Convenient handling and simple operations in day-to-day activities of the applications center, as the time was less to receive the optimum image, specifically during the visits of the customer. This made the sale of Viscom’s X8011 to be in a high rate, Helmut added.