Posted in | News | Business

Everett Charles Technologies to Exhibit New HyperCore Base Material at SEMICON Taiwan Expo

Everett Charles Technologies will exhibit the new HyperCore base material at the forthcoming SEMICON Taiwan Expo, which will be conducted at the TWTC Nangand Hall in Taipei, Taiwan, from September 5 to 7, 2012.

ECT ZIP HyperCore

HyperCore is an in-house base material designed for the fine-pitch, highly scalable ZIP probe series. The material does not require plating and demonstrates 600 Knoop hardness. It has resistance to tip deformation and wear usually produced by cleaning cycles and mass production. It can be cleaned repeatedly as it is non-plated, thus offering record probe life. Its RF behavior and contact resistance are equivalent to that of gold plated BeCu. For instance, the Z0-050 HyperCore demonstrates constant 50 mW resistance and more than 40 GHz bandwidth. The base material has also resistance to oxides like gold, thus delivering superior performance even in adverse conditions.

Everett Charles Technologies will also showcase its extensive portfolio of semiconductor products, which include Bantam and ZIP contacts. ZIP's high scalability solutions for wide-range of applications will comprise ZIP Z1 and Z2, ZIP SCRUB, ZIP KELVIN, ZIP SUPER SHORT, ZIP Extended Length, and Z8.

ZIP Z1 and Z2 are superior performance production contacts for typical high-speed applications in 0.3, 0.4, 0.5, and 0.8 mm pitches. The ZIP SCRUB pin has a patented scrub-action. Designs for BGA, pad and leaded applications offer a self cleaning penetrating motion per compression that lengthens the average time between cleaning cycles. ZIP KELVIN is suitable for voltage sensitive device tests or peripheral devices demanding sub-1 ohm resistance measurements, which are normal in high-power and RDSON applications.

ZIP SUPER SHORT is developed for 0.5 nH low impedance, high frequency testing. The ZIP Extended Length allows rapid customization of travel and OAL as high as 6.7 mm. The Z3 line is designed for applications that need a high degree of compliance for contacting strip packages and large devices. The Z8 is developed for burn-in applications. It features the same form factor as that of the Z1 and Z2 lines, thus enabling flawless shifting from lab characterization to mass production. The ZIP patented 2-D design has planar contact surfaces created by a novel production process, thus offering cost benefits and superior performance.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Chai, Cameron. (2019, February 09). Everett Charles Technologies to Exhibit New HyperCore Base Material at SEMICON Taiwan Expo. AZoM. Retrieved on November 21, 2024 from https://www.azom.com/news.aspx?newsID=33804.

  • MLA

    Chai, Cameron. "Everett Charles Technologies to Exhibit New HyperCore Base Material at SEMICON Taiwan Expo". AZoM. 21 November 2024. <https://www.azom.com/news.aspx?newsID=33804>.

  • Chicago

    Chai, Cameron. "Everett Charles Technologies to Exhibit New HyperCore Base Material at SEMICON Taiwan Expo". AZoM. https://www.azom.com/news.aspx?newsID=33804. (accessed November 21, 2024).

  • Harvard

    Chai, Cameron. 2019. Everett Charles Technologies to Exhibit New HyperCore Base Material at SEMICON Taiwan Expo. AZoM, viewed 21 November 2024, https://www.azom.com/news.aspx?newsID=33804.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.