A team of researchers from the National Cheng Kung University (NCKU), Taiwan, led by professor for materials science and engineering, Lin Kwang-lung have developed a novel alloy-based solder that is deemed as a significant advance in packaging for semiconductor devices.
The new material is an alloy of Tin, Zinc, Silver, Aluminum and Gallium (Sn-Zn-Ag-Al-Ga) and scores high on reliability and cost reduction.
The potential capabilities of the new material have piqued the interest of local industries. Efforts are on to test the performance of the alloy in semiconductor packaging. The alloy has been granted patents inthe United States, Taiwan and Japan.
Professor Lin stated that the collaboration with the industries has resulted in the successful manufacture of solder balls with industrially specified diameters of 0.30, 0.50 and 0.75 mm. Further validation of the patented alloy comes from semiconductor manufacturer ASE which has stated that performance testing conducted on solder made from the new alloy has established that the performance is better than solder made from conventional alloy of Tin, Silver and Copper (Sn-Ag-Cu). The cost of existing solder material has risen drastically mainly due to increasing copper prices.
According to Professor Lin, the new alloy is 15% cheaper than other alloys in the market as the alloy makes use of metals that are low on cost. The team hopes to collaborate with manufacturers to commercialize the new material.
After more than seven years of research, Lin stated that he is looking forward to work with manufacturers to devise commercial applications for the new material.