Feb 27 2013
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 Low Temperature Cure Die Attach Adhesive for attaching semiconductor die in temperature-sensitive devices. Applications include smart cards, camera modules, flex circuits and more.
DB-1568-1 Low Temperature Cure Die Attach Adhesive
The DB-1568-1 is more than 90 percent cured after 30 minutes at 80°C, but has a dispensing work life greater than 48 hours (measured as a 25 percent increase in viscosity), while maintaining optimized rheology for stencil printing and excellent damp heat resistance and conductivity stability. DB-1568-1 features extreme flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in flexible electronics and display applications. Also, this material can be fast cured at elevated temperatures (1 minute @ 180°C).
DB-1568-1 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
For more information about the DB-1568-1 Low Temperature Cure Electrically Conductive Die Attach Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company.