Aug 30 2013
FormFactor Inc. will present products from its portfolio of fine-pitch 40µm grid-array pitch probe solutions at the annual 3D-TEST Workshop, taking place September 12-13 at the Disneyland Hotel in Anaheim, Calif.
FormFactor is a corporate sponsor of this year's 3D-TEST Workshop, which follows the September 10-12 International Test Conference (ITC), the world's largest single exposition of semiconductor test products, systems and services.
At the 3D-TEST Workshop, FormFactor will feature its 40µm grid-array pitch contactor technology for direct testing of Through-Silicon-Vias (TSVs), as well as grid-array micro-bumps or copper pillars for 2.5D/3D IC integration. This proprietary contactor technology is being evaluated by leading memory semiconductor manufacturers in their TSV development programs. The company will discuss certain new developments achieved with the contactor technology in a formal presentation and table-top demonstration at the 3D-TEST Workshop. The company's contactor technology was honored earlier this year at the IEEE VLSI Test Symposium in Berkeley when a presentation titled "Direct Connection and Testing of TSV and Micro-bump Devices using NanoPierce™" captured the "Best Paper Award" for FormFactor authors Dr. Onnik Yaglioglu and Ben Eldridge, the company's CTO.
On Friday, September 13, FormFactor executives and technologists will participate in the following events at the 3D-TEST Workshop:
Session 7: 3D Wafer Probing
10:55am
"Very Low Damage Direct Testing of Micro-bumps for 3D IC Integration".
Co-presentation by technologists from Elpida Memory, Inc. and FormFactor.
Session 10: Special Session on 2013 3DInCites Awards
3:00pm-4:00pm
A panel discussion featuring the nominees and the winner of the 2013 3DInCites Awards' Test and Reliability Tools and Equipment category.
FormFactor will be represented on the panel by Mike Slessor, SVP & General Manager, MicroProbe Product Group.
In addition to the presentations, FormFactor executives will be on hand throughout the week to meet with customers. To schedule a briefing, please contact Amy Leong at [email protected].
Further information on the 2013 3D-TEST Workshop and ITC can be found at www.itctestweek.org.
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