Sep 6 2013
Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc., announced today that one of its volume manufacturing partners, Universal Instruments Corporation, will be presenting a high volume manufacturing (HVM) solution for Invensas Corporation's Bond Via Array (BVATM) technology at the SEMICON Taiwan TechXPOT on Sept. 5, 2013.
The presentation and video demonstration, entitled Assembly Solutions for Wide IO Package-on-Package Applications, demonstrates the high-volume process optimization and reliability qualification of BVA processor-to-memory stacking as the solution to increasing bandwidth and performance in small form-factor mobile applications. The paper and videos will be available at Invensas.com from Sept. 6, 2013.
"We are delighted at the completion of this critical milestone by our partner, Universal Instruments Corporation," stated Simon McElrea, president of Invensas. "The ability to provide our customers with a reliable volume production process for BVA Package-on-Package (PoP) manufacturing is an essential element of our technology adoption strategy."