Sep 15 2006
Integrated Materials, Inc. announces that Hynix Semiconductor, Inc., a leading supplier of semiconductor memory products, selected Integrated Materials' SiFusion(TM) furnaceware for its 300 mm production line in Ichon, Korea. IMI's SiFusion(TM) boats will be used in LPCVD processes for the manufacture of advanced memory chips.
SiFusion(TM) pure poly silicon boats eliminate the frequent routine cleaning required by competing silicon carbide and quartz products, increasing available furnace production time and generating cost savings for the fab. With the adoption of SiFusion boats, Hynix anticipates improved process stability, enhanced throughput and lower overall defect rates.
"We are excited to provide Hynix with the furnaceware it needs to realize more effective furnace utilization and superior process performance," said Tom Cadwell, president and CEO of Integrated Materials. "SiFusion furnaceware opens the door for higher throughput, lower costs and easier process migration to next-generation 65-nanometer and 45-nanometer designs."
Qualification Test Results
Overall results of Hynix's qualification testing data show SiFusion(TM) easily met Hynix's stringent production criteria, which were unachievable for competing products. The testing data revealed significant cost savings compared to alternative solutions.
"After testing the SiFusion(TM) 300 mm boats it is clear that these boats are easily integrated into our system," a Senior Engineering Manager at Hynix Semiconductor, Inc. stated. "In addition, we saw increased tool uptime and improved process performance which allows Hynix to increase production of the latest memory products that our customers seek."