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Metafoam Technologies to Attend Semi-Therm

Mar 2 2007

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Metafoam Technologies announces that it will attend Semi-Therm international forum dedicated to semiconductor thermal measurement and management. This symposium and exposition will be held next March 18th to 22nd at San Jose (CA).

Metafoam wishes to take advantage of this forum to meet potential partners interested in the development and commercialization of its innovative heat pipes, cold plates and boiling surfaces made of metal foams.

Dominic Pilon, Founder, Vice-President R&D and CTO, and Karine Vézina, Marketing Director of Metafoam, will attend Semi-Therm. They invite companies involved in products dedicated to electronics cooling to contact Mrs. Vézina (see contact information below) to set up a meeting.

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