May 10 2007
Sempac Inc, a Sunnyvale, California based manufacturer devoted to the design, development of “air-cavity” plastic packages used mainly during the prototype and test phase announces the addition of TopLine, to their distribution network.
TopLine, known in the industry for providing dummy components and practice PC boards will expand their product offering with Sempac’s QFN, SOIC, SOP and LQFP “Open-Pak” Technology plastic packages. Sempac and TopLine share in the same philosophy for low cost solutions in their respective markets and together are offering application and design engineers’ expertise and technical support.
Some of the key features and benefits of Sempac Open-Pak Packages are:
Ideal for Device Development for Telecom, Optoelectronic, RF MEMS and SensorDevices Bring new devices for Cell Phones, PDA’s and Digital Cameras to the market quicker Packages meet JEDEC Outline and Footprint, are Reliable and Low Cost Ideal solution for Device Development and Die Qualification Compatible with High Volume Plastic Packages
“This new partnership will ultimately establish one more quick-turn resource for design engineers. By partnering we are helping our customers with increased engineering support which will accelerate the customer’s products to the market faster…”