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Results 141 - 150 of 276 for Electronic packaging
  • Rigid Curing Epoxy Adhesive EP30HT
    Article - 19 Jul 2012
    Hard, rigid curing adhesives, sealants and coatings offer high physical strength properties.
  • One Component Snap Cure Adhesive
    Article - 13 Jul 2012
    Master Bond Inc. single component EP17HT-3 epoxy adhesive cures in 2-3 minutes at 250-300°F.
  • Short Shot Detection in an Injection Molding Using Heat Flux Sensors
    Article - 30 May 2011
    A heat flux sensor is highly sensitive and can measure the quantity of heat transfer between the the mould and the injected material, without any direct contact. Taking such measurements in real time...
  • Feature and Benefits of MicroCure 1600 Variable Frequency Microwave Curing Oven
    Article - 6 Oct 2010
    The Source 1600 is our most flexible Variable Frequency Microwave (VFM) system for process development and OEM system development, allowing remote cavity placement for in-situ and inline processing.
  • Variable Frequency Microwave for Chip-On-Board Glob Top Curing
    Article - 6 Oct 2010
    The demand for lighter, faster, smaller and less expensive products has led the electronics manufacturing industry to the use of new packaging techniques such as DCA and Chip on Board technology.
  • Materials Testing - The Role Of Force Testers In Materials Evaluation
    Article - 3 Nov 2016
    Force testers offer simple peak load measurements, while materials testers provide precise evaluations with advanced features for complex testing.
  • Solders - An Overview
    Article - 27 Aug 2001
    Development of solder technology is being driven by miniaturisation. Surface mount technology now dominates and demands on solders are changing. Solders are now part of the mechanical bond as well as...
  • Condoms - An Overview
    Article - 14 Jun 2001
    Everything you need to know about condoms including history and origins, production, materials (natural rubber and synthetics such as latex and polyurethanes), testing methods, barrier properties,...
  • Adhesives - An Introduction
    Article - 16 Mar 2001
    This article provides an introduction into the area of adhesives. It covers areas such as background, terminology, why adhesives are used, advantages and limitations and where they will be used in the...
  • An Introduction to Ceramics
    Article - 8 Oct 2024
    Ceramics are inorganic, nonmetallic materials characterized by their diverse properties and applications, playing a key role in industries like aerospace, electronics, and sustainable energy.

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