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Results 151 - 160 of 747 for Printing Electronic Devices
  • Article - 27 Feb 2002
    The addition of buckytubes to polymer matrices can introduce fascinating mechanical, electrical and thermal properties as well as opening the door to a range of new applications. These new...
  • Article - 27 Feb 2002
    Buckytubes are a type of fullerene or perfect carbon structure. The discovery, evolution and structure of single and multiwall buckytubes are considered. Advantages over other materials including...
  • Article - 16 Feb 2002
    The only material that is practically used for electron emitters is tungsten. Although there are other electropositive metals that yield higher emission rates, tungsten has an extremely low vapor...
  • Equipment
    The Mega II is an efficient, automated closed loop, solvent regenerative, electronic assembly and parts cleaning system with quantitative ionic detection, removal and statistical process control...
  • Equipment
    This module provides the same functions as the transfer conveyor with the possibility of stopping the PCB for a manual operation on it.
  • Equipment
    The MASCOT STANDALONE Workstation is a uniquely quick and reliable solution for building PCBs precisely. A MASCOT STANDALONE Workstation will minimise PCB build times, improve your production quality...
  • Equipment
    The F2000W Edge belt workstation can support a full array of workstation components. It can be arranged with just an inspect feature or be suited with a full assortment of lights, shelves, document...
  • Equipment
    This Multi Functional low cost workstation benefits from having Formagrinds’s ESD safe Gel mat fitted enabling practical down draft extraction. The Gel compound offers a firm yet protective surface...
  • Article - 20 Jul 2001
    Copper is tough and ductile, but is valuable due its ability to conduct electricity. While it is suited to many applications most centre around its excellent electrical conductivity (e.g. busbars and...
  • Article - 25 Apr 2001
    Similar to DAIP, but better resistance to alkalies. Lower temperature resistance (160°C/320°F compared with 180°C/360°F for DAIP). Tensile strength approximately 10% lower than DAIP.

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