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Results 281 - 290 of 1176 for Electrical devices
  • Article - 31 Jul 2001
    The process of pulse laser deposition is described as is the equipment used. It has the ability to deposit a range of single and multicomponent materials and produce coating thicknesses to tight...
  • Article - 26 Jul 2001
    This article provides details on how aluminium nitride is produced, key properties and its applications, including microelectronics.
  • Article - 23 Jul 2001
    Uranium is a heavy, silver-white metal resembling nickel. It is malleable, ductile, slightly paramagnetic and pyrophoric when finely divided. Its main uses are as a nuclear fuel, radioactive isotope...
  • Article - 20 Jul 2001
    Copper is tough and ductile, but is valuable due its ability to conduct electricity. While it is suited to many applications most centre around its excellent electrical conductivity (e.g. busbars and...
  • Article - 5 Jun 2001
    Porous silicon has semiconducting properties as well as displaying bioactivity. This makes it potentially a useful material for electronic implant devices. Properties and production are described.
  • Article - 30 May 2001
    Hot pressed composites in the system Al2O3-ZrO2-AlN-SiCw-X where X denotes additions of TiB2, TiC, BN or Nb. They combined electrical conductivity with refractoriness, wear and impact resistance and...
  • Article - 28 May 2001
    Processes such as plasma spraying, flame spraying and high velocity oxy-fuel spraying are briefly explained. Applications such as surface protection, wear and corrosion resistance, microelectronics,...
  • Article - 23 May 2001
    High purity nickel powders can be produced via the carbonyl process. These powders can be used for powder metallurgy applications. Uses include automotive, filters, batteries and multilayer...
  • Article - 7 May 2001
    Elastic electret films of electromechanical film (EMFi) have the ability to sense the slightest touch, change their thickness accordingly to an external voltage and produce sound in the process....
  • Article - 25 Apr 2001
    Similar to DAIP, but better resistance to alkalies. Lower temperature resistance (160°C/320°F compared with 180°C/360°F for DAIP). Tensile strength approximately 10% lower than DAIP.

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