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  • EVG®520 HE Semi-Automated Hot Embossing System
    Equipment
    The EVG520 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates.
  • EVG®510 HE Semi-Automated Hot Embossing System
    Equipment
    The EVG510 HE Semi-automated Hot Embossing System is designed for high-precision imprinting of thermoplastic substrates.
  • Cutting Mill SM 300 from RETSCH
    Equipment
    The Cutting Mill SM 300 is ideal for grinding a variety of products, like soft, fibrous, elastic, hard, medium-hard, and heterogeneous mixtures.
  • Saint-Gobain Specialty Grains and Powders
    Supplier Profile
    At Saint-Gobain Specialty Grains and Powders, we design and manufacture tailored material solutions for our customers, worldwide. Our advanced ceramic materials solutions enable our customers to...
  • Dynavac
    Supplier Profile
    For over 30 years Dynavac has been designing and manufacturing Thin Film Deposition System for evaporation, sputtering and PECVD applications. System configurations are offered for batch, inline and...
  • Hardinge Inc.
    Supplier Profile
    Hardinge Inc. is a leading international provider of advanced metal-cutting solutions. We provide a full spectrum of highly reliable CNC turning, milling, and grinding machines as well...
  • Bruker Nano Analytics
    Supplier Profile
    The companies under Bruker Inc. are globally leading manufacturer of analytical systems for life and materials sciences. The Bruker Nano Analytics (BNA) Division, headquartered at Bruker Nano GmbH in...
  • STA-10 - Automated Plasma System
    Equipment
    Surfx STA-10 is a plasma system designed to improve the adhesion of substrates, allowing for high-volume manufacturing of electronics.
  • Emax: High Energy Ball Mill from RETSCH
    Equipment
    The Emax is a new kind of ball mill specifically designed for high energy milling.
  • Extending Wall Thickness for Catheter Designs with Zeus Sub-Lite-Wall Tubing
    Equipment
    The Zeus Sub-Lite-Wall® tubing belongs to the Zeus family of thin-walled extrusions with wall thicknesses of 0.005" (0.127 mm) and below. At present, the company has taken this technology even further...

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Editorial Highlights

The Current State of the Global Semiconductor Market

The Current State of the Global Semiconductor Market

The global semiconductor market has entered an exciting period. Demand for chip technology is both driving the industry as well as hindering it, with current chip shortages predicted to last for some time. Current trends will likely shape the future of the industry, which is set to continue to show

How are Graphene Batteries Made?

How are Graphene Batteries Made?

The primary distinction between graphene-based batteries and solid-state batteries lies in the composition of either electrode. Although the cathode is commonly changed, carbon allotropes can also be employed in fabricating anodes.

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