The STA-10iL automated plasma system is engineered to clean and activate substrates for enhanced adhesion, making it ideal for semiconductor packaging and electronics manufacturing. It features standard in-line conveyance for high-volume production, with an optional drawer available for high-mix, low-volume manufacturing needs.
Inside the STA-10iL, a three-axis gantry precisely applies advanced atmospheric plasma to your substrates. The system utilizes Surfx’s Atomflo™ controller, which operates with low-voltage radio frequency (RF) power to generate a uniform, particle-free, and electrically neutral plasma. This plasma is safe for use on even the most sensitive electronics.
Numerous solutions are available for in-line or batch production with complete traceability using the STA-10iL:
- Inert gas purge for reducing gas chemistry
- Substrate heating and cooling
- Oxygen plasma for organic clean
- Hydrogen plasma for metal oxide removal
- Cleanroom class 100 (10,000 is standard)
Image Credit: Surfx Technologies, LLC
STA-10iL Specifications
- Work area (X * Y * Z): 550 × 760 × 60 mm
- Footprint (W * D * H): 1,000 × 1,500 × 1,550 mm, 39.4 × 59.1 × 61.0 inches
- Software and OS: Cloudbreak™ for quick development of programs
- Patented plasma technology:
- Atmospheric argon plasma
- RF capacitive discharge
- O2, H2, N2 plasma chemistry
The STA-10iL is specially made for single-part traceability, high dependability, and zero-damage precision plasma cleaning of semiconductors and other devices.
Source: Surfx Technologies, LLC
| Specifications |
| Power supply |
200~240 VAC, 31 A, 50/60 Hz |
| Air supply (CDA) |
0.4-0.6 MPa (60-90 psig), <280 LPM (<10 CFM) |
| Footprint (W*D*H) |
1,000 x 1,500 x 1,550 mm (39.4 x 59.1 x 61.0 inches) |
| Weight |
1,050 kg (2,315 lbs) |
| Exhaust (flange, factory flow required) |
100mm (4inch), 500 CMH (300 CFM) |
| Motion system |
| Work area (X * Y * Z) |
550 x 760 x 60 mm |
| X Y Z repeatability |
XY: +/- 0.025 mm @ 3 sigma, Z: +/- 0.005 mm @ 3 sigma |
| Max speed |
1,000 mm/s (X, Y) |
| Acceleration |
1.0 g |
| Drive system |
AC servo & precision ground ball screw |
| Machine specifications |
| Conveyor type and payload |
Belt, 3 kg (6.6 lbs) |
| Trafficking communication |
SMEMA |
| Software and OS |
Cloudbreak™ operating on Windows 10 |
| Max top and bottom side clearance |
25 mm (1.0 inch) |
| Atomflo™ plasma specifications |
| RF Power |
600 W at 27.12 MHz |
| Main plasma gas |
Argon (Ar) |
| Process gases |
Oxygen (O2), nitrogen (N2), or hydrogen (5.0% H2 in Ar) |
| Process specifications |
| Nominal contact angle after plasma |
WCA < 10⁰ (native oxide on silicon wafer) |
| Plasma cleaning process |
O2 + Ar to remove organics, or H2 + Ar to remove metal oxidation |
Image Credit: Surfx Technologies, LLC