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Results 5721 - 5730 of 5756 for Electronic applications
  • Book
    An essential resource for scientists designing new energy materials for the vast landscape of solar energy conversion as well as materials processing and characterization.
  • Article - 29 Nov 2001
    Powder injection moulding (PIM) and powder co-injection moulding (PCM) are similar to polymer injection moulding. They are used to produce shaped components from powders and are suited to ceramic,...
  • Article - 18 Sep 2001
    Very good flame retardant characteristics (VO>2) compared with unmodified SAN (HB). Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Equipment
    The Mega II is an efficient, automated closed loop, solvent regenerative, electronic assembly and parts cleaning system with quantitative ionic detection, removal and statistical process control...
  • Article - 7 Sep 2001
    Good combination of tensile strength and flexural modulus combined with the best electrical characteristics of PPS grades.
  • Article - 7 Sep 2001
    Good cost/performance ratio. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 21 Aug 2001
    Combined advantage gained from using glass and mineral fillers. Relative advantages, disadvantages and applications are listed together with a table of typical properties.
  • Article - 20 Aug 2001
    Has superior surface finish compared to cast epoxy components, however, does have a tendancy to stick in the mould. Relative advantages, disadvantages and applications are listed together with a table...
  • Article - 20 Aug 2001
    Highest oxygen index and lowest mould shrinkage compared with other epoxy moulding compounds. Relative advantages, disadvantages and applications are listed together with a table of typical...
  • Article - 20 Aug 2001
    Relative advantages, disadvantages and applications are listed together with a table of typical properties.

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