The newest version of Bruker's TI 990 TriboIndenter® offers advanced measurement modes, faster testing speeds, and expanded capabilities for thorough nanomechanical characterization.
Every step of the measurement and analysis process incorporates cutting-edge technology, such as the advanced Performech® III controller, the latest TriboScan™ 12 software, the next-generation nanoDMA® IV dynamic nanoindentation measurement mode, and the high-speed mechanical property mapping provided by XPM™ II.
Define What is Possible
With TI 990, the nanomechanical testing process becomes incredibly customizable. Users can mount the sample in the lab without worrying about restrictive stages or environmental noise. Program the experiment for any duration without being confined to a single feedback mode or data acquisition limit.
TI 990 keeps up with dynamic testing needs, whether the user needs higher throughput for combinatorial materials science, enhanced accuracy for polymer thin films, or multi-measurement analysis of complete 300 mm semiconductor wafers.
Image Credit: Bruker Nano Surfaces and Metrology
Only TI 990 Delivers:
- Unmatched performance for nanoindentation, nanoscratch, and nanowear testing
- Recent developments in Performech control technology, including XPM II ultrahigh-speed mechanical property mapping and nanoDMA IV dynamic nanoindentation.
- Most streamlined system operation with superior control over the measurement process
- Completely redesigned TriboScan 12 operating software with aided and streamlined workflow
- Unlimited potential for future developments in nanoscale characterization
- The largest collection of cutting-edge nanomechanical techniques in the world, a modular system architecture, and flexible sample mounting options.
The New Standard for Nanoindentation
Industry-leading noise floors enable quantitative measurement down to single-nanometer contact depths. Image Credit: Bruker Nano Surfaces and Metrology
Exceptional Performance and Control
Industry-Leading Noise Floors
Superior results are achieved in the widest range of laboratory environments thanks to the combination of exclusive electrostatic actuation technology, ultralow-noise electronics, an active anti-vibration system, a rigid granite platform, and a specially designed environmental enclosure.
Performech III Advanced Control Module
With its dual lock-in amplifiers and parallel processing, the newest Hysitron® control technology offers unprecedented capabilities for test function definition, ultra-fast feedback control, and creative new control modes.
Unique Testing and Characterization
XPM II high-resolution, ultrahigh-speed property mapping up to 12 measurements/sec. Image Credit: Bruker Nano Surfaces and Metrology
nanoDMA IV with CMX
Powerful characterization of mechanical properties as a function of depth, frequency, and time is made possible by next-generation dynamic nanomechanical testing with dual lock-in amplifiers for 2nd-harmonic measurements, automated displacement amplitude tuning, force amplitude control, and displacement feedback control.
XPM II Accelerated Property Mapping
Dynamic property mapping based on depth, high-resolution mechanical property mapping with an industry-leading throughput of 12 measurements/second, and sophisticated machine-learning clustering algorithms ensures dependable and quick data analysis.
In-situ SPM Imaging
Improved measurement accuracy and repeatability, a test positioning accuracy of ±10 nm, the capacity to link sample morphology and mechanical properties, and post-test material deformation observation are all made possible by top-down scanning probe microscopy (SPM).
User-Focused Operation and Analysis
In-situ SPM imaging enables high-precision test placement to within ±10 nm. Image Credit: Bruker Nano Surfaces and Metrology
TriboScan 12 Control Software
TriboScan 12 offers the newest nanomechanical testing modes and streamlines system operation, from sample setup to results, thanks to its user-friendly design.
Tribo iQ™ Data Analysis Software
Tribo iQ is a family of technique-specific data analysis, plotting, and reporting applications for thorough and adaptable analysis. It is based on an advanced scientific software engine.
Powerful Base Configuration
Maximize the Characterization Potential
Image Credit: Bruker Nano Surfaces and Metrology
Measure More, Measure Better
Keeping the User at the Forefront of Materials Innovation
TI 990 can be tailored to measure over six orders of magnitude in force, and eleven orders of magnitude in displacement accurately, catering to users' measurement needs both presently and in the future.
There are mounting options for magnetic, mechanical, and vacuum samples in a universal sample chuck for a large variety of sample shapes and sizes. More samples can be tested in an automated workflow, and larger surface areas can be analyzed using a testable area that is 60 % larger than that of earlier TriboIndenter systems.
For better multi-technique characterization of samples with large or complex geometries, an optional dual Z-stage design allows independent control of any combination of two measurement heads.
In addition to offering a high degree of measurement mode configurability, TI 990 was designed for high-precision measurements across a broad range of laboratory environments. It also facilitates easy integration of future advanced techniques:
- The system can function at its best in a variety of environments by the vibration-dampening base, which is a 50x increase in environmental noise immunity.
- A large internal volume and modular environmental enclosure offer remarkable versatility, enabling the system to be customized for specific research requirements.
TI 990 boasts unmatched Performech III technology, which combines strong, real-time control and signal processing with up to 16 parallel data acquisition channels and a simultaneous 1.25 MHz data sampling rate across all channels.
Superior precision and control during the measurement process are ensured by industry-leading noise floors, dual lock-in amplifiers for 2nd-harmonic measurement, an ultrafast force and displacement control feedback loop rate, and unlimited data acquisition and test segment programmability.
Simple Operation and Comprehensive Analysis
Image Credit: Bruker Nano Surfaces and Metrology
The Tribo iQ suite of analysis applications and the new TriboScan 12 control software makes system setup, data collection, and analysis easier than ever. Data can be gathered from any operator location by remotely operating the entire system setup and measurement process.
A dedicated sample-chuck camera facilitates the efficient definition of sample location, and numerous cameras within the environmental enclosure allow operators to view the transducer and staging locations in real-time during system setup with TriboScan 12.
The sample optics are automatically focused, which enables operators to navigate to the desired testing region quickly. The Tribo iQ suite of more than 15 technique-specific applications offers unparalleled data analysis, plotting, and reporting capabilities when the data has been gathered.
No System Has More Modes
TI 990 is equipped with a robust set of techniques that allow for thorough nanomechanical characterization of materials.
Nanoindentation
- Industry-leading noise floors with maximum measurement accuracy and repeatability are provided by a unique combination of capacitive displacement sensing and electrostatic actuation.
- Superior control over the testing process is provided by the ultrafast 78 kHz feedback control loop rate.
Image Credit: Bruker Nano Surfaces and Metrology
Nanoscratch
- Extreme sensitivity for nanoscale interfacial and tribological measurements is provided by electrostatic actuation in both normal and lateral directions.
- Quantitative thin-film adhesion and friction measurement is made possible by high-precision normal and lateral force measurements.
Image Credit: Bruker Nano Surfaces and Metrology
Nanowear
- Determine the material removal rate quantitatively in relation to the probe speed, wear passes, and applied probe force.
- Determine the wear volumes across interfaces, on thin films, and in individual phases or materials.
Image Credit: Bruker Nano Surfaces and Metrology
In-Situ SPM Imaging
- Allows for enhanced nanomechanical characterization by means of validated test placement, precise placement of probes with an accuracy of ±10 nm, and the observation of material deformation behavior.
- Options for adjusting SPM resolution from 64 × 64 to 4096 × 4096.
- Without requiring hardware modifications, dual piezo scanners enable in-situ SPM imaging using any combination of electrostatic transducers.
Image Credit: Bruker Nano Surfaces and Metrology
XPM II
- Exceptionally fast quantitative mechanical property measurements (12/second)
- Acquiring data 1000 times faster than with traditional quasi-static nanoindentation testing
- High-resolution spatial mapping of hardness and modulus with distribution statistics
- Compatibility of xSol® environmental control stages for quick testing in harsh environments
Image Credit: Bruker Nano Surfaces and Metrology
nanoDMA IV with CMX
- A quantitative assessment of the elastic-plastic and viscoelastic properties in relation to depth, frequency, and time.
- Automatic adjustment of displacement amplitude for 2nd harmonic analysis using dual lock-in amplifiers.
- Specialized drift correction for long-term testing.
- Constant surface contact ensured by force amplitude control, especially when measuring at low depths or on highly plastic materials.
Image Credit: Bruker Nano Surfaces and Metrology
Expanding Capabilities
Comprehensive Suite of Upgrade Options Enable TI 990 to Evolve as Needed
The xSol Environmental Stage allows for the quantitative, accurate, and dependable characterization of nanotribological and nanomechanical processes at temperatures as high as 800 °C. Measurements at low temperatures and controlled humidity can be made possible by expanding the xSol.
The xSol design incorporates a micro-environment for guaranteed tip/sample temperature equilibrium and the ability to test under customizable gaseous atmospheres.
Image Credit: Bruker Nano Surfaces and Metrology
The 3D OmniProbe extends force and displacement measurement capabilities from the nano to the micro regime for both indentation and scratch tests. Its design features higher forces and greater displacements, specifically developed to enable the micromechanical characterization of rough, thick, or hard films.
Image Credit: Bruker Nano Surfaces and Metrology
Additional Upgrade Options
Source: Bruker Nano Surfaces and Metrology
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| nanoECR |
In-situ conductive nanoindentation correlates nanomechanical properties, material deformation behavior, and electrical characteristics of materials |
| iTF |
Patented analytical software package that provides quantitative, substrate effect-free elastic properties of thin films |
| MultiRange NanoProbe |
Expanded force- and displacement-range transducer providing microscale mechanical testing |
| Synchronized Raman Spectroscopy |
Spatial correlation of mechanical and tribological properties with material structure and chemistry |
| Modulus Mapping |
Scanning dynamic nanoindentation mode provides quantitative, high-resolution maps of viscoelastic properties across a surface |
| Fluorescence Microscopy |
Integrated fluorescence microscope enables fluorochrome-guided test placement |
| Electrochemical Cell |
Quantitative, in-situ measurements of nanoscale mechanical and tribological behavior under oxidizing and reducing conditions |
| Automated Probe Changer |
Push-button exchange of testing probes provides maximum uptime, ease of use, and probe-customizable automation routines |
| Sample Chucks |
Diverse range of magnetic, mechanical, and vacuum chucks secure almost any sample for testing, up to a 300 mm wafer |
| TriboAE |
Transducer that provides in-situ, through-tip monitoring of acoustic signals generated from fracture and deformation events during the nanoindentation process |
| TriboImage |
Time-resolved cyclic nanoscale scratch/wear characterization |
| Dual Z Stages |
Independent approach/withdrawal of any two measurement heads, enabling multi-technique characterization on large substrates |