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20 Micron Thick Wafer Possible with Ultrathin Semiconductor Wafer Backgrinding System from 3M

Fuji Heavy Industries and Saab to Collaborate on Cross Over Vehicle

GKN to Establish Advanced Composites Facility for Aerostructures

US Promote Fuel Cell Development to Hasten Zero Emissions Energy

ASV Sign LOI to Acquire Loegering

UCB to Sell Films Business for 320 Million Euros

Boeing Complete 90% of Design of World’s Longest Range Jetliner

IBM Scientists Make Breakthrough in Nanoscale Imaging

Hydro to Upgrade Their Italian Aluminium Rolling Mill

USWA Ratify Labour Agreement with WCI Steel

Nitronex Begins Selling GaN-on-Silicon Epi Wafers

Lockheed Martin Begin Assembly of F-35 Joint Strike Fighter Forward Fuselage

Teijin Twaron Announce a Further Capacity increase for Twaron Production

Brunei Introduce Polymeric $50 and $100 Bills

Faster Test For Checking The Efficiency Of The Paints Used As Protection Against Corrosion In The Automotive Industry

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