Microsemi, a company providing semiconductor solutions, has developed a new die packaging technology that will reduce the size of radio modules employed in medical implant devices by 75%.
At FachPack trade fair to be conducted in Nuremberg, BASF will exhibit its full range of particle foams for packaging applications and to protect high-value products. BASF specialty foams are ideal for a myriad of packaging applications, allowing customers to safeguard their highly sensitive items. Neopolen, a closed-cell particle foam, is a fitting material for reusable transport containers and recyclable packaging. It is offered as Neopolen E (expanded polyethylene) and Neopolen P (expanded polypropylene) in the market.
Market research solutions provider, Research and Markets has announced the addition of a new report to its offering that is prepared by Canadean and titled, "Packaging Techniques and New Packaging Trends in the Food and Beverage Industry - 2011-2012: Survey Intelligence".
Research and Markets, a company providing market research solutions, has added a new report titled “Aseptic Packaging Market in China 2011-2015" to its report offering.
Unisource Worldwide’s division, Unisource Global Solutions, a provider of ground-breaking, globally sustainable packaging solutions, has concluded the asset acquisition of Pakit Sweden, which develops and markets molded fiber solutions for use in the packaging industry.
EarthSleeve, a new packaging solution, has been introduced by Starbucks Coffee along with Henkel, a company focused on consumer and industrial businesses, and LBP Manufacturing, a provider of consumer-preferred, sustainable, on-the-go packaging solutions.
A global packaging specialist, MeadWestvaco (MWV), has introduced an ergonomic trigger actuated aerosol sprayer, Ergosol, for home and garden applications.
BRICdata has prepared the report titled "Packaging Industry Outlook in South Africa: Market Size, Key Trends, Drivers and Challenges to 2016", which offers comprehensive market analysis, insights and information on the South African packaging industry and is available in MarketPublishers.com.
Bemis and Thin Film Electronics have reported that they have inked a joint contract to make a Bemis intelligent packaging platform. This joint agreement will expedite the commercial growth of functional sensor labels.
Research and Markets has reported the inclusion of a new report titled ‘Global Packaging Survey 2012-2013: Market Trends, Buyer Spend and Procurement Strategies in the Global Packaging Industry’ to its catalogue.
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