Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After having applied Scanning Acoustic Microscopy to temporary wafer (de)bonding inspection, they successfully used new advanced GHz SAM technology to detect TSV voids at wafer-level after TSV Copper plating. Together, they will continue to investigate the applicability of high-frequency scanning acoustic microscopy for non-destructive submicron void detection.
The International Tennis Federation (ITF) has taken delivery of a new automated tennis ball testing system from Mecmesin.
Ball manufacturers are required to submit samples of their products to the Inte...
Silicon wafers destined to become photovoltaic (PV) cells can take a bruising through assembly lines, as they are oxidized, annealed, purified, diffused, etched, and layered to reach their destinies as efficient converters of the sun's rays into useful electricity.
Cascade Microtech, Inc., a leading expert at enabling precision measurements of integrated circuits at the wafer level, today announced the CM300, a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity.
ViTrox Technologies, a solutions provider of innovative, advanced and cost-effective automated vision inspection systems and equipment for the semiconductor and electronics packaging industries, will exhibit in Booth #2707 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California.
Visitors to the Freeman Technology booth at the annual IFPAC Meeting (22-25 January Baltimore, MD, USA) can find out how the company’s FT4 Powder Rheometer® universal powder tester is being used by pharmaceutic...
ADCOLE Corporation is introducing an upgraded camshaft measuring machine that has been engineered to handle longer camshafts for large diesel engines, and provides submicron accuracy.
The University of Texas at Arlington and Thermo Fisher Scientific Inc., the world leader in serving science, announced that they have been granted a United States patent (#8,293,099) for a novel charge detector for ion chromatography that they developed together. The invention has been commercialized as the Thermo Scientific Dionex QD detector, which was introduced in March 2012 at the Pittcon Conference and Expo.
The SBS-6000 battery analyzer available from Storage Battery Systems (SBS) is a rugged handheld storage battery tester which serves as a complete voltage and resistance testing kit for batteries ranging from 1.2 to 48 Vdc. The analyzer relays test data via RJ45 or RS232 ports and complies with all IEEE/NERC standards.
Agilent Technologies Inc. today introduced the industry’s first eMMC (embedded multimedia card) compliance test application for embedded storage solutions.
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