Quantenna Communications, Inc. a leader in ultra-reliable Wi-Fi networking for whole-home entertainment, announced today that it received the prestigious Start-up to Watch award at the 2013 Global Semiconductor Alliance (GSA) Awards Dinner Celebration on December 12th. The awards are presented annually to outstanding semiconductor companies worldwide that have demonstrated excellence through their success, vision and strategy in the industry.
Research and Markets has announced the addition of the "Global SiC Single-Crystal Technology Market Report 2013-2020" report to their offering.
Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal integrated circuits (ICs), today announced that it won the Global Semiconductor Alliance’s (GSA) Most Respected Public Semiconductor Company award in the category of companies achieving $251 million to $1 billion in annual sales. Silicon Labs received this prestigious industry accolade at the 2013 GSA Awards Dinner Celebration held on Dec. 12 in Santa Clara, California.
CyberOptics Corporation today announced that it has introduced a comprehensive set of WaferSense offerings to support the semiconductor industry’s new 450mm wafer initiative and thus position this product line for ongoing growth.
Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, today announced the signing of a global distribution agreement with Alliance Memory Inc., a worldwide provider of legacy memory products.
Advanced Semiconductor Engineering, Inc. ("ASE" or the "Company") announces the following facts in connection with the operations of its packaging/testing site No. 1 in Chungli, Taoyoun, Taiwan (the "Chungli No.1 packaging/testing site")
ZMD AG (ZMDI), a Dresden-based semiconductor company that specializes in enabling energy efficient solutions, today announces the launch of the ZSSC3027, a leading-edge 16-bit sensor signal conditioning IC (SSC) with an integrated 18-bit digital signal processor (DSP) for linearization and calibration functions.
Solid State Equipment LLC (SSEC), a leading provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and compound semiconductor markets, today announces two major wins for its WaferStorm platform at a leading foundry in Asia and a major US integrated device manufacturer (IDM).
Aehr Test Systems (Nasdaq:AEHR), a leading supplier of semiconductor test and burn-in equipment, today announced it has received over $1 million in a follow-on order for its FOX-15 wafer-level burn-in and test system and WaferPak full-wafer contactors from a leading supplier of automotive and industrial integrated circuits.
CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.
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