Feb 18 2008
SiC Systems, Inc., a closely-held manufacturer of silicon carbide substrates, announced successful sales of their Series A investment round which will fund the company to delivery of 150mm (6 inch) silicon carbide wafers later this year. The company recently completed construction of their first manufacturing facility and has begun operation.
SiC Systems’ patent pending manufacturing process, in development for almost two years, overcomes the fundamental design challenges present in current manufacturers’ methods. The proprietary system will permit SiC Systems to produce even larger diameter wafers in the future with the process which features none of the scaling or quality problems which plague the nascent industry currently.
Said Ken Whelan, CEO, “We are extremely grateful for the support and confidence demonstrated by our investors to date, and are anxious to reward them as we pursue this improvement in semiconductor technology vital to attaining cost-effective solid state lighting and high power density devices. We are excited about bringing silicon carbide to mainstream semiconductor manufacturers several years ahead of industry expectation.”