Apr 23 2009
DuPont Printed Circuit Materials (PCM), part of DuPont Electronic Technologies, has introduced two new Laser Direct Imaging (LDI) dry film photoresists for the production of advanced printed wiring boards (PWBs). DuPont Riston LDI7200 dry film photoresist is designed for use with 355 nanometer (nm) LDI equipment and is ideal for plating applications. DuPont Riston LDI8000 has been developed for use with 405 nm light sources.
PCM has introduced two new films for laser direct imaging of printed wiring boards.
As PWB fabricators invest millions of dollars in LDI equipment to help reduce cycle time and produce more sophisticated designs for electronic devices, specialized films such as the Riston LDI series are essential to optimize their investment, throughput and yields.
"DuPont was first to the market with specialized resists for laser direct imaging, and we're continuing to develop new, more advanced formulations to help our customers succeed," said Mark Dirks, global marketing manager, PCM. "PWB fabricators need to make the most of their investments, and we've worked with leading LDI equipment suppliers to help ensure our resists quickly and reliably produce the most technically challenging fine line circuit designs and optimize throughput on a full range of equipment."
Riston LDI7200 and LDI8000 are the newest additions to the broad and growing Riston LaserSeries product portfolio.