Nordson ASYMTEK Unveils Automated Workcell for Film-Frame Wafer-Level Packaging Applications

Nordson ASYMTEK has launched its automated workcell, a combination of MH-910W same-side loader/unloader and Spectrum S-920N dispenser, for applications in film-frame wafer-level packaging at SEMICON West.

Automated Work Cell comprising MH-910W same-side loader/unloader and Spectrum S-920N dispenser

The new workcell is developed for processing 150 mm film-frame wafer but can also handle different sizes. It can be used in jet dispensing of biochip reagent, wafer coating for imaging equipment like digital light processing, image sensor/MEMS capping, jetting of thin layer of coatings before laser dicing to minimize dust produced by ablation fall-out during the dicing process.

The workcell is compact, measures 1225x1321 mm and complies with CE, SMEMA, SEMI-S8 and SEMI-S2 certifications and standards. Its S-920N dispensing system and MH-910W film-frame loader/unloader are completely covered with interlocked windows and doors to ensure component and operator protection. Its access panels can be separated easily and its integrated software maintenance tools allow trouble-free servicing.

The workcell features active pinch wheels and numerous sensors to assure safe handling, while the MH-910W same-side loader/unloader offers programmable transport speed to optimize units per hour. Film-frame wafers are dragged from one cassette and then entered into a second cassette subsequent to the dispensing process. A frame sensor locates the next wafer and helps in decreasing search time for partly filled cassettes.

During loading, active pinch wheels and a soft-touch gripper drag the film-frame wafers from the cassette and pass them into the system. Prior to returning processed wafers into the second cassette, sensors confirm that the cassette slots are empty.

Citations

Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Chai, Cameron. (2019, February 09). Nordson ASYMTEK Unveils Automated Workcell for Film-Frame Wafer-Level Packaging Applications. AZoM. Retrieved on November 25, 2024 from https://www.azom.com/news.aspx?newsID=29908.

  • MLA

    Chai, Cameron. "Nordson ASYMTEK Unveils Automated Workcell for Film-Frame Wafer-Level Packaging Applications". AZoM. 25 November 2024. <https://www.azom.com/news.aspx?newsID=29908>.

  • Chicago

    Chai, Cameron. "Nordson ASYMTEK Unveils Automated Workcell for Film-Frame Wafer-Level Packaging Applications". AZoM. https://www.azom.com/news.aspx?newsID=29908. (accessed November 25, 2024).

  • Harvard

    Chai, Cameron. 2019. Nordson ASYMTEK Unveils Automated Workcell for Film-Frame Wafer-Level Packaging Applications. AZoM, viewed 25 November 2024, https://www.azom.com/news.aspx?newsID=29908.

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type
Submit

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.