Alchimer has introduced the AquiVia TSV, a novel film-deposition technology for through-silicon via (TSV) barrier-layer process. The barrier layer is one of the bottom-most components in the TSV film stack.
Claudio Truzzi, who serves as the Chief Technical Officer at Alchimer, stated that the current etching technologies have the tendency to form steps, scalloping and other surface patterns that make subsequent film deposition difficult. Vacuum-based deposition processes were not able to deposit high-quality barrier layers, particularly in deep, small-diameter vias having aspect rations of 10:1 and above, which were required to completely realize the cost benefits of three-dimensional integration, he added.
The AquiVia TSV barrier-layer process can deliver 100% uniform step coverage on intricate silicon surface such as high-aspect-ratio vias with scalloped walls. Its superior coverage capability allows the deposition of subsequent layers at a significantly lower cost and time, thus eliminating remediate issues in the barrier layer.
The 100% coverage also prevents a coverage-associated reliability and performance issues that can happen during the subsequent fill and seed-layer deposition. The TSV technology is critical for three-dimensional integration processes that will enable numerous chips to be stacked and interlinked. This is a suitable solution for packing additional memory, computing power and other capabilities into much smaller devices, including tablet computers, smartphones and other portable consumer electronics.
Alchimer’s full line of wet deposition products and AquiVia Barrier reduces expenses by 40-50% when compared to other standard dry processes. Customers have the options to select any combination of fills and films or a single film in order to meet their application demands.